Product Types
High performance heat-resistant adhesive film
High performance polyimide encapsulation film
Product Usage
As a complementary product of polyimide coated copper foil, it can be used for conventional multi-layer flexible boards (M-FPC) or high-density interconnect boards (HDI)
Interlayer bonding
High viscosity products can also be used for bonding between various PI reinforcement materials and FPC boards Other occasions with strict requirements for solder resistance, yellowing resistance, etc.
Product Features
Extremely high peel strength, less affected by oil stains or release agents, high adhesive strength after double 85
Stable overflow amount, not affected by compression bonding process, storage time and temperature
Low moisture absorption rate, excellent solder resistance, low explosion rate
Colorless or extremely light in color, with little color change after curing
Adjustable surface viscosity, suitable for bonding the outer layer of FPC with four or less layers, as well as bonding PI, FR4 or steel sheet reinforcement materials
Compliant with RoHS and REACH directives, safe and environmentally friendly
