Product Usage
Used in conjunction with encapsulation film, thermosetting adhesive film and other materials for circuit fabrication in printed circuit boards Product Features
Customizable copper foil/base film thickness
Excellent peel strength and dimensional stability
High localization rate, excellent cost-effectiveness
Compliant with RoHS and REACH directives, halogen-free and environmentally friendly
UL certified product, flame retardant up to 94V-0 level
